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      <dc:title>Development and RF-Performance of AlGaN/GaN and InAlN/GaN HEMTs on Large-Diameter High-Resistivity Silicon Substrates</dc:title>
      <dc:creator>Moser, M.</dc:creator>
      <dc:creator>Pradhan, M.</dc:creator>
      <dc:creator>Alomari, M.</dc:creator>
      <dc:creator>Schoch, B.</dc:creator>
      <dc:creator>Sharma, K.</dc:creator>
      <dc:creator>Kallfass, I.</dc:creator>
      <dc:creator>García-Luque, A.</dc:creator>
      <dc:creator>Martín-Guerrero, Teresa María</dc:creator>
      <dc:creator>Burghartz, J. N.</dc:creator>
      <dc:subject>Silicio</dc:subject>
      <dc:subject>Aluminio</dc:subject>
      <dc:description>A CMOS-compatible industrial processing and RF analysis of 150 mm GaN-on-HR-Si substrates with AlGaN and InAlN barrier is presented. Process development along with transfer to large-wafer scale is shown and some HEMT calibration devices produced on AlGaN/GaN following the aforementioned procedure are characterized in terms of RF-performance by using a set of measured multi-bias S-parameters. An automatic small-signal equivalent circuit extraction strategy for these AlGaN/GaN DUTs is validated and some de-embedded figures of merit are drawn out in order to initially evaluate this promising technology.</dc:description>
      <dc:date>2022-10-03T09:37:13Z</dc:date>
      <dc:date>2022-10-03T09:37:13Z</dc:date>
      <dc:date>2022</dc:date>
      <dc:type>conference output</dc:type>
      <dc:identifier>https://hdl.handle.net/10630/25159</dc:identifier>
      <dc:language>eng</dc:language>
      <dc:relation>The 17th European Microwave Integrated Circuits Conference (EuMIC)</dc:relation>
      <dc:relation>Milano (Italy)</dc:relation>
      <dc:relation>26th – 27th September 2022</dc:relation>
      <dc:rights>open access</dc:rights>
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