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oai:riuma.uma.es:10630/394522026-02-03T11:20:29Zcom_10630_2254col_10630_37953

Zamudio-García, Javier Chiabrera, Francesco Morin-Martínez, Armando Antonio Castelli, Ivano Eligio Ramírez-Losilla, Enrique Marrero-López, David Esposito, Vincenzo 2025-07-23T09:15:53Z 2025-07-23T09:15:53Z 2024-10-17 Zamudio-García, J., Chiabrera, F., Morin-Martínez, A. et al. Hierarchical exsolution in vertically aligned heterostructures. Nat Commun 15, 8961 (2024). https://doi.org/10.1038/s41467-024-53252-y https://hdl.handle.net/10630/39452 10.1038/s41467-024-53252-y Metal nanoparticle exsolution from metal oxide hosts has recently garnered great attention to improve the performance of energy conversion and storage devices. In this study, the nickel exsolution mechanisms in a vertically aligned nanostructure (VAN) thin film of heteroepitaxial (Sr0.9Pr0.1)0.9Ti0.9Ni0.1O3−δ- Ce0.9Gd0.1O1.95 with a columnar architecture was investigated for the first time. Experimental results and Density Functional Theory (DFT) calculations reveal that themultiple vertical interphases in a VAN with a hierarchical arrangement provide faster and more selective Ni diffusion pathways to the surface than traditional bulk diffusion in epitaxial films. Kinetic studies conducted at different temperatures and times indicate that the nucleation process of the exsolved metal nanoparticles primarily takes place at the surface through the phase boundaries of the columns. The vertical strain is crucial in preserving the film’s microstructure, yielding a robust heteroepitaxial architecture after reduction. This innovative heteromaterial opens up new possibilities for designing efficient devices through advanced structural engineering to achieve controlled nanoparticle formation. eng http://creativecommons.org/licenses/by-nc-nd/4.0/ open access Attribution-NonCommercial-NoDerivatives 4.0 Internacional Electroquímica Películas delgadas Hierarchical exsolution in vertically aligned heterostructures journal article