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dc.contributor.authorPérez-Escribano, Mario 
dc.contributor.authorMoreno-Rodríguez, Salvador
dc.contributor.authorMolero, Carlos
dc.contributor.authorValenzuela-Valdés, Juan Francisco
dc.contributor.authorPadilla, Pablo
dc.contributor.authorAlex-Amor, Antonio
dc.contributor.authorPérez-Escribano, Mario 
dc.date.accessioned2024-04-29T07:16:02Z
dc.date.available2024-04-29T07:16:02Z
dc.date.created2024
dc.date.issued2023-11-06
dc.identifier.urihttps://hdl.handle.net/10630/31172
dc.description.abstractThis manuscript introduces an analytical framework for the design of reconfigurable metasurfaces rooted in 2D periodic structures. Incorporating lumped elements into the model streamlines the design process for such devices, offering significantly improved efficiency compared to designs reliant on full-wave software. The theoretical framework, founded on Floquet modal expansions, also guarantees robust performance even under oblique incidence conditions, far beyond the onset of the first grating lobe. In practical applications, an absorber has been devised by integrating a resistor into the model. Nevertheless, circuit analysis extends the possibilities for crafting more intricate structures utilizing diodes or tunable varactors, enabling the design of phase shifters, polarizers, and reconfigurable intelligent surfaces (RIS).es_ES
dc.language.isoenges_ES
dc.publisherIEEE Transactions on Circuits and Systems II: Express Briefses_ES
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 Internacional*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectTelecomunicacioneses_ES
dc.subjectConductores eléctricoses_ES
dc.subjectFotónicaes_ES
dc.subject.otherAnalytical frameworkes_ES
dc.subject.otherLumped elementses_ES
dc.subject.otherMetasurfaceses_ES
dc.subject.otherFloquet expansiones_ES
dc.subject.otherOblique incidencees_ES
dc.subject.otherReconfigurablees_ES
dc.titleAnalytical Framework to Model Reconfigurable Metasurfaces including Lumped Elements.es_ES
dc.typejournal articlees_ES
dc.centroE.T.S.I. Telecomunicaciónes_ES
dc.identifier.doi10.1109/TCSII.2023.3330318
dc.type.hasVersionAMes_ES
dc.departamentoIngeniería de Comunicaciones
dc.rights.accessRightsopen accesses_ES


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